发明申请
- 专利标题: CATALYTIC SURFACE ACTIVATION METHOD FOR ELECTROLESS DEPOSITION
- 专利标题(中): 用于电沉积的催化表面活化方法
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申请号: US12831217申请日: 2010-07-06
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公开(公告)号: US20100272903A1公开(公告)日: 2010-10-28
- 发明人: Jeong-Hoon Byeon , Jae-Hong Park , Ki-Young Yoon , Jung-Ho Hwang
- 申请人: Jeong-Hoon Byeon , Jae-Hong Park , Ki-Young Yoon , Jung-Ho Hwang
- 申请人地址: KR Seoul
- 专利权人: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSIY
- 当前专利权人: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSIY
- 当前专利权人地址: KR Seoul
- 优先权: KR10-2007-0001631 20070105
- 主分类号: B05D3/10
- IPC分类号: B05D3/10
摘要:
Provided is a catalytic surface activation method for electroless deposition comprising a metallic aerosol nanoparticle generation step of generating metallic aerosol nanoparticles, which act as plating initiation catalyst; a metallic aerosol nanoparticle fixation step of fixing the resultant metallic aerosol nanoparticles on a plating surface; and an electroless deposition step of impregnating the material to be plated in an electroless deposition solution to form a plating layer on the plating surface on which the metallic aerosol nanoparticles have been fixed. The catalytic surface activation method for electroless deposition of the present invention is applicable to large-scale plating with simple process and superior applicability, improves the plating characteristics with little impurity generation, requires no post-treatment process for removing impurities and is environment-friendly with no wastewater generation by directly fixing metallic aerosol nanoparticles on the material to be plated.
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