A method for removing a coating layer from a substrate structure. The method includes the steps of positioning a sheet of interface material on the substrate structure with a first, inner face of the interface material in engagement with a predetermined area of the coating layer, and exciting a second, outer face of the interface material with an ultrasonic frequency kinetic energy. The ultrasonic energy causes the predetermined area of the coating layer in contact with the inner face of the interface Material to be substantially completely removed.