发明申请
US20100276775A1 SEMICONDUCTOR LIGHT RECEIVING ELEMENT 失效
半导体接收元件

  • 专利标题: SEMICONDUCTOR LIGHT RECEIVING ELEMENT
  • 专利标题(中): 半导体接收元件
  • 申请号: US12810089
    申请日: 2008-12-25
  • 公开(公告)号: US20100276775A1
    公开(公告)日: 2010-11-04
  • 发明人: Emiko Fujii
  • 申请人: Emiko Fujii
  • 优先权: JP2007334669 20071226
  • 国际申请: PCT/JP2008/003949 WO 20081225
  • 主分类号: H01L31/107
  • IPC分类号: H01L31/107 H01L31/0352
SEMICONDUCTOR LIGHT RECEIVING ELEMENT
摘要:
The semiconductor light receiving element 1 includes a semiconductor substrate 101, and a semiconductor layer having a photo-absorption layer 105 disposed on the top of the semiconductor substrate 101. The semiconductor layer of the semiconductor light receiving element 1 containing at least the photo-absorption layer 105 has a mesa structure, and a side wall of the mesa is provided with a protective film 113 covering the side wall. The protective film 113 is a silicon nitride film containing hydrogen, and a hydrogen concentration in one surface of the protective film 113 located at the side of the mesa side wall is lower than a hydrogen concentration in the other surface of the protective film 113 located at the side that is opposite to the side of the mesa side wall.
公开/授权文献
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L31/00 对红外辐射、光、较短波长的电磁辐射,或微粒辐射敏感的,并且专门适用于把这样的辐射能转换为电能的,或者专门适用于通过这样的辐射进行电能控制的半导体器件;专门适用于制造或处理这些半导体器件或其部件的方法或设备;其零部件(H01L51/42优先;由形成在一共用衬底内或其上的多个固态组件,而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00)
H01L31/08 .其中的辐射控制通过该器件的电流的,例如光敏电阻器
H01L31/10 ..特点在于至少有一个电位跃变势垒或表面势垒的,例如光敏晶体管
H01L31/101 ...对红外、可见或紫外辐射敏感的器件
H01L31/102 ....仅以一个势垒或面垒为特征的
H01L31/107 .....以雪崩模式工作的势垒,如雪崩光二极管
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