发明申请
- 专利标题： INSULATED METAL SUBSTRATES INCORPORATING ADVANCED COOLING
- 专利标题（中）： 包含高级冷却的绝缘金属基板
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申请号： US12433301申请日： 2009-04-30
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公开(公告)号： US20100277868A1公开(公告)日： 2010-11-04
- 发明人: Richard Alfred Beaupre , Peter Almern Losee , Xiaochun Shen , John Stanley Glaser , Joseph Lucian Smolenski , Adam Gregory Pautsch
- 申请人： Richard Alfred Beaupre , Peter Almern Losee , Xiaochun Shen , John Stanley Glaser , Joseph Lucian Smolenski , Adam Gregory Pautsch
- 申请人地址： US NY SCHENECTADY
- 专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人地址： US NY SCHENECTADY
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.
公开/授权文献
- US08232637B2 Insulated metal substrates incorporating advanced cooling 公开/授权日：2012-07-31
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