发明申请
- 专利标题： TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- 专利标题（中）： 化学机械抛光温度控制
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申请号： US12433559申请日： 2009-04-30
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公开(公告)号： US20100279435A1公开(公告)日： 2010-11-04
- 发明人: Kun Xu , Jimin Zhang , Stephen Jew , Thomas H. Osterheld
- 申请人： Kun Xu , Jimin Zhang , Stephen Jew , Thomas H. Osterheld
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; C23F1/08
摘要：
A chemical mechanical polishing apparatus including a platen for holding a pad having a polishing surface, a subsystem for holding a substrate and the polishing surface together during a polishing step, and a temperature sensor oriented to measure a temperature of the polishing surface, wherein the subsystem accepts the temperature measured by the sensor and is programmed to vary a polishing process parameter in response to the measured temperature. In an aspect, a chemical mechanical polishing apparatus having a platen for holding a pad having a polishing surface, a fluid delivery system for transporting a fluid from a source to the polishing surface, and a temperature controller which during operation controls the temperature of the fluid transported by the delivery system.
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