A process for embossing a web substrate is disclosed. The process comprises the steps of: 1. disposing the web substrate in a circumferentially elongate nip formed between a pattern roll having a circumference and an embossing pattern disposed upon a surface thereof and a continuous belt disposed about at least a portion of the circumference of the pattern roll; 2. providing the continuous belt with a surface speed corresponding to a speed of the web substrate; and, 3. juxtaposing the embossing pattern upon the web substrate while the web substrate is disposed within the elongate nip.