发明申请
- 专利标题： COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF COMPONENT BUILT-IN WIRING BOARD
- 专利标题（中）： 组件内置接线板和组件内置接线板的制造方法
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申请号： US12740694申请日： 2008-10-29
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公开(公告)号： US20100301473A1公开(公告)日： 2010-12-02
- 发明人: Kenji Sasaoka
- 申请人： Kenji Sasaoka
- 申请人地址： JP Tokyo
- 专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007-284754 20071101; JP2007-302883 20071122; JP2007-322062 20071213
- 国际申请： PCT/JP2008/069678 WO 20081029
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/50
摘要：
Disclosed is a component built-in wiring board, including a first insulating layer; a second insulating layer positioned in a laminated state on the first insulating layer; a semiconductor element buried in the second insulating layer, having a semiconductor chip with terminal pads and having surface mounting terminals arrayed in a grid shape connected electrically with the terminal pads; an electric/electronic component further buried in the second insulating layer; a wiring pattern sandwiched between the first insulating layer and the second insulating layer, including a first mounting land for the semiconductor element and a second mounting land for the electric/electronic component; a first connecting member connecting electrically the surface mounting terminal of the semiconductor element with the first mounting land; and a second connecting member connecting electrically the terminals of the electric/electronic component with the second mounting land, made of a same material as a material of the first connecting member.
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