Invention Application
- Patent Title: ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 声波装置及其制造方法
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Application No.: US12864073Application Date: 2008-11-26
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Publication No.: US20100301700A1Publication Date: 2010-12-02
- Inventor: Toshiyuki Fuyutsume , Taro Nishino , Hisashi Yamazaki , Kiyoto Araki , Noboru Tamura , Nakaba Ichikawa , Masaki Aruga
- Applicant: Toshiyuki Fuyutsume , Taro Nishino , Hisashi Yamazaki , Kiyoto Araki , Noboru Tamura , Nakaba Ichikawa , Masaki Aruga
- Applicant Address: JP Kyoto JP Yamanashi
- Assignee: MURATA MANUFACTURING CO., LTD.,KOIKE CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.,KOIKE CO., LTD.
- Current Assignee Address: JP Kyoto JP Yamanashi
- Priority: JP2008-015441 20080125
- International Application: PCT/JP2008/071416 WO 20081126
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H01L41/22

Abstract:
Provided are an acoustic wave device and a method for manufacturing the same, the acoustic wave device being effectively prevented from expanding and contracting due to temperature change and having a small frequency shift. The acoustic wave device of the present invention has a piezoelectric substrate (1) having an IDT (2) formed on one principal surface of the piezoelectric substrate (1), and a thermal spray film (3) formed on an opposite principal surface (1b) of the piezoelectric substrate (1), the thermal spray film being of a material having a smaller linear thermal expansion coefficient than the piezoelectric substrate (1) and having grain boundaries and pores (4), at least a part of which is filled with a filling material (5).
Public/Granted literature
- US08319394B2 Acoustic wave device and method for manufacturing the same Public/Granted day:2012-11-27
Information query
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