Invention Application
US20100302417A1 SOLID-STATE IMAGE PICKUP DEVICE MANUFACTURING METHOD THEREOF, ELECTRONIC APPARATUS 有权
电子设备的固态图像拾取器件的制造方法

  • Patent Title: SOLID-STATE IMAGE PICKUP DEVICE MANUFACTURING METHOD THEREOF, ELECTRONIC APPARATUS
  • Patent Title (中): 电子设备的固态图像拾取器件的制造方法
  • Application No.: US12778298
    Application Date: 2010-05-12
  • Publication No.: US20100302417A1
    Publication Date: 2010-12-02
  • Inventor: Takashi AbeTetsuya Uchida
  • Applicant: Takashi AbeTetsuya Uchida
  • Applicant Address: JP Tokyo
  • Assignee: SONY CORPORATION
  • Current Assignee: SONY CORPORATION
  • Current Assignee Address: JP Tokyo
  • Priority: JP2009-132743 20090602
  • Main IPC: H04N9/04
  • IPC: H04N9/04 H01L31/18
SOLID-STATE IMAGE PICKUP DEVICE MANUFACTURING METHOD THEREOF, ELECTRONIC APPARATUS
Abstract:
A solid-state image pickup device includes photoelectric conversion parts formed on an image pickup surface of a substrate, where each photoelectric conversion part generates a signal charge by receiving incident light on a light reception surface thereof, and color filters formed on an image-pickup surface of the substrate, where each color filter allows the incident light to be colored by passing through. The photoelectric conversion parts are aligned in first and second directions and include first to third color filters. A surface on which the first color filter and the second color filter are laminated in the first direction is larger than a surface on which the first color filter and the third color filter are laminated in the second direction.
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