发明申请
US20100304564A1 SELECTIVE LOCAL INTERCONNECT TO GATE IN A SELF ALIGNED LOCAL INTERCONNECT PROCESS 有权
选择性本地连接在自对准的本地连接过程中进行

  • 专利标题: SELECTIVE LOCAL INTERCONNECT TO GATE IN A SELF ALIGNED LOCAL INTERCONNECT PROCESS
  • 专利标题(中): 选择性本地连接在自对准的本地连接过程中进行
  • 申请号: US12475796
    申请日: 2009-06-01
  • 公开(公告)号: US20100304564A1
    公开(公告)日: 2010-12-02
  • 发明人: Richard T. Schultz
  • 申请人: Richard T. Schultz
  • 主分类号: H01L21/3205
  • IPC分类号: H01L21/3205
SELECTIVE LOCAL INTERCONNECT TO GATE IN A SELF ALIGNED LOCAL INTERCONNECT PROCESS
摘要:
A semiconductor device fabrication process includes forming a gate of a transistor on a semiconductor substrate using a hard mask. The hard mask is selectively removed in one or more selected regions over the gate. The removal of the hard mask in the selected regions allows the gate to be connected to an upper metal layer through at least one insulating layer located substantially over the transistor. Conductive material is deposited in one or more trenches formed through the at least one insulating layer. The conductive material forms a local interconnect to the gate in at least one of the selected regions.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02 .半导体器件或其部件的制造或处理
H01L21/04 ..至少具有一个跃变势垒或表面势垒的器件,例如PN结、耗尽层、载体集结层
H01L21/18 ...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料
H01L21/30 ....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的(在半导体材料上制作电极的入H01L21/28)
H01L21/31 .....在半导体材料上形成绝缘层的,例如用于掩膜的或应用光刻技术的(密封层入H01L21/56);以及这些层的后处理;这些层的材料的选择
H01L21/3205 ......非绝缘层的沉积,例如绝缘层上的导电层或电阻层;这些层的后处理(电极的制造入H01L21/28)
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