发明申请
- 专利标题： SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 半导体封装及其制造方法
-
申请号： US12612304申请日： 2009-11-04
-
公开(公告)号： US20100308449A1公开(公告)日： 2010-12-09
- 发明人: Hung-Jen YANG , Min-Lung Huang
- 申请人： Hung-Jen YANG , Min-Lung Huang
- 优先权： TW98118370 20090603
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A manufacturing method of semiconductor package is provided. A carrier is provided. The chips are disposed on the carrier. The chips are encapsulated by a molding compound, so that the molding compound and the chips form a chip-redistribution encapsulant. The carrier is removed, so that the chip-redistribution encapsulant exposes the pads of the chips. The plasma is applied on the pads and the molding compound. A first dielectric layer is formed on the pads and the surface of the molding compound. The plasma is applied on a surface of the first dielectric layer. A patterned conductive layer is formed on the surface of the first dielectric layer. A second dielectric layer is formed on the patterned conductive layer and the first dielectric layer. A plurality of solder balls are formed on the second dielectric layer. The chip-redistribution encapsulant is divided so as to form a plurality of packages.
信息查询
IPC分类:
