发明申请
US20100310828A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSED BY THIS METHOD
审中-公开
基板处理方法和基板由本方法处理
- 专利标题: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSED BY THIS METHOD
- 专利标题(中): 基板处理方法和基板由本方法处理
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申请号: US12743054申请日: 2008-11-13
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公开(公告)号: US20100310828A1公开(公告)日: 2010-12-09
- 发明人: Susumu Sakio , Hideo Takei , Kazuya Saito , Kazuhiro Watanabe , Shinsuke Iguchi , Hiroyuki Yamakawa , Kyuzou Nakamura , Yu-hsin Lin , Huang-choung Chang , Tung-jung Wu
- 申请人: Susumu Sakio , Hideo Takei , Kazuya Saito , Kazuhiro Watanabe , Shinsuke Iguchi , Hiroyuki Yamakawa , Kyuzou Nakamura , Yu-hsin Lin , Huang-choung Chang , Tung-jung Wu
- 申请人地址: JP Kanagawa
- 专利权人: ULVAC, INC.
- 当前专利权人: ULVAC, INC.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2007-297810 20071116
- 国际申请: PCT/JP2008/070713 WO 20081113
- 主分类号: B32B3/30
- IPC分类号: B32B3/30 ; C23F1/00 ; H01L33/00 ; H01L31/18
摘要:
[Object]To provide a substrate processing method capable of forming a concavo-convex structure on a substrate surface while reducing the number of processes.[Solving Means] In a substrate processing method according to the present invention, particles are dispersed on a surface of a substrate, and a concavo-convex structure is formed on the surface of the substrate by etching the surface of the substrate with the particles as a mask and the mask is simultaneously removed by the etching. According to this method, a process of removing the mask from the substrate surface after the concavo-convex structure is formed becomes unnecessary. Accordingly, since the number of processes necessary to form the concavo-convex structure on the substrate surface is largely reduced, it becomes possible to greatly improve productivity.
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