发明申请
US20100319735A1 CLEANING COMPOSITION AND METHOD FOR CLEANING SUBSTRATE FOR ELECTRONIC DEVICE
有权
用于清洁电子设备的基板的清洁组合物和方法
- 专利标题： CLEANING COMPOSITION AND METHOD FOR CLEANING SUBSTRATE FOR ELECTRONIC DEVICE
- 专利标题（中）： 用于清洁电子设备的基板的清洁组合物和方法
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申请号： US12867468申请日： 2009-02-13
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公开(公告)号： US20100319735A1公开(公告)日： 2010-12-23
- 发明人: Makoto Hidaka , Taku Ogura
- 申请人： Makoto Hidaka , Taku Ogura
- 申请人地址： JP Sumida-ku, Tokyo
- 专利权人： Lion Corporation
- 当前专利权人： Lion Corporation
- 当前专利权人地址： JP Sumida-ku, Tokyo
- 优先权： JP2008-035165 20080215
- 国际申请： PCT/JP2009/052383 WO 20090213
- 主分类号： B08B3/12
- IPC分类号： B08B3/12 ; C11D3/60
摘要：
A cleaning composition which is capable of removing both organic soiling and particulate soiling adhered to a substrate for an electronic device with a high degree of cleanliness, and which also has minimal impact on the environment, as well as a method of cleaning a substrate for an electronic device. The present invention relates to a cleaning composition used for cleaning a substrate for an electronic device including a water-soluble salt (A) containing a transition metal, a chelating agent (B) and a peroxide (C), wherein the amount of the chelating agent (B) is not less than 0.5 molar equivalents relative to the amount of the water-soluble salt (A) containing a transition metal.
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