发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有堆叠集成电路的集成电路包装系统及其制造方法
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申请号： US12488383申请日： 2009-06-19
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公开(公告)号： US20100320586A1公开(公告)日： 2010-12-23
- 发明人: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- 申请人： Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/50
摘要：
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a base component to the substrate by a first interconnect; attaching a stack component connected by a second interconnect to the substrate and partially over the base component, the second interconnect different from the first interconnect; molding an encapsulation over the base component, the first interconnect, the stack component, and the second interconnect; and removing the substrate to partially expose the first interconnect and the second interconnect from the encapsulation.