发明申请
US20100323476A1 ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
审中-公开
用于制造半导体器件的超声波接合设备，半导体器件及其制造方法
- 专利标题： ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- 专利标题（中）： 用于制造半导体器件的超声波接合设备，半导体器件及其制造方法
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申请号： US12853970申请日： 2010-08-10
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公开(公告)号： US20100323476A1公开(公告)日： 2010-12-23
- 发明人: Masataka NANBA , Shigeru Tanabe
- 申请人： Masataka NANBA , Shigeru Tanabe
- 申请人地址： JP Minato-ku
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Minato-ku
- 优先权： JP2004-324640 20041109; JP2005-310170 20051025
- 主分类号： H01L21/607
- IPC分类号： H01L21/607
摘要：
An ultrasonic bonding equipment for manufacturing a semiconductor device comprises a tip portion. The tip portion has a top surface which is faced to a member to be bonded, and propagates an ultrasonic vibration to the top surface. A plurality of protruding portions are provided on the top surface. Each of the protruding portions has: a first pair of opposite side surfaces inclined with respect to the top surface; and a second pair of opposite side surfaces substantially vertical to the top surface. A semiconductor device comprises: a semiconductor chip; a lead; and a bonding strap electrically connecting the semiconductor chip and the lead. A recess is formed on an upper surface of the bonding strap in at least one of a first region where the bonding strap and the semiconductor chip are connected and a second region where the bonding strap and the lead is connected. A first pair of opposite side surfaces of the recess are inclined with respect to the upper surface of the bonding strap, and a second pair of opposite side surfaces of the recess are substantially vertical to the upper surface of the bonding strap.
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