发明申请
- 专利标题: LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- 专利标题(中): 发光装置及其制造方法
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申请号: US12827319申请日: 2010-06-30
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公开(公告)号: US20110001156A1公开(公告)日: 2011-01-06
- 发明人: Makoto Matsuda , Toyonori Uemura , Toshio Hata
- 申请人: Makoto Matsuda , Toyonori Uemura , Toshio Hata
- 优先权: JP2009-157133 20090701
- 主分类号: H01L33/44
- IPC分类号: H01L33/44 ; H01L21/00
摘要:
A light emitting device includes: a substrate; an LED chip provided on a main surface of the substrate; and a printed resistor element connected in parallel with the LED chip, the printed resistor element being provided in at least one of regions (i) on the main surface of the substrate, (ii) on a back surface of the substrate, and (iii) inside the substrate. According to the arrangement, it is possible to provide: a light emitting device which can emit light having preferable luminance without a reduction in optical output by suppressing light shielding and light absorption of light emitted from the LED toward the outside; and a method for manufacturing the light emitting device.
公开/授权文献
- US08399899B2 Light emitting device 公开/授权日:2013-03-19
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