发明申请
- 专利标题： METHODS AND APPARATUSES FOR LARGE DIAMETER WAFER HANDLING
- 专利标题（中）： 用于大直径波浪处理的方法和装置
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申请号： US12812729申请日： 2009-01-13
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公开(公告)号： US20110005967A1公开(公告)日： 2011-01-13
- 发明人: Barry Gregerson , Michael Shawn Adams , Jason Todd Steffens
- 申请人： Barry Gregerson , Michael Shawn Adams , Jason Todd Steffens
- 申请人地址： US MA Billerica
- 专利权人： ENTEGRIS, INC.
- 当前专利权人： ENTEGRIS, INC.
- 当前专利权人地址： US MA Billerica
- 优先权： US61020736 20080113; US61134604 20080711
- 国际申请： PCT/US09/30870 WO 20090113
- 主分类号： H01L21/673
- IPC分类号： H01L21/673
摘要：
A front opening semiconductor wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
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