发明申请
US20110006405A1 SEMICONDUCTOR DEVICE, MANUFACTURE METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
审中-公开
半导体器件，半导体器件的制造方法和电子设备
- 专利标题： SEMICONDUCTOR DEVICE, MANUFACTURE METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
- 专利标题（中）： 半导体器件，半导体器件的制造方法和电子设备
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申请号： US12818331申请日： 2010-06-18
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公开(公告)号： US20110006405A1公开(公告)日： 2011-01-13
- 发明人: Keiichi YAMAMOTO , Takashi FUKUDA
- 申请人： Keiichi YAMAMOTO , Takashi FUKUDA
- 申请人地址： JP Kawasaki-shi
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP2009-160552 20090707
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/71
摘要：
A semiconductor device includes a substrate, an electronic component and a resin member. The substrate has a first electrode. The electronic component is provided on the substrate, and has a second electrode electrically connected to the first electrode. The resin member alleviates an external stress to the second electrode of the electronic component. The resin member is disposed on the substrate at a region separated from the electronic component.
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