Invention Application
- Patent Title: METHOD AND SYSTEM FOR FABRICATING A CONDUCTIVE PLATE
- Patent Title (中): 制造导电板的方法和系统
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Application No.: US12830428Application Date: 2010-07-05
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Publication No.: US20110011528A1Publication Date: 2011-01-20
- Inventor: JEAH-SHENG WU , JIA-SHYONG CHENG , PO-SHENG SHIH , CHIH-HAN CHAO , CHEN FENG
- Applicant: JEAH-SHENG WU , JIA-SHYONG CHENG , PO-SHENG SHIH , CHIH-HAN CHAO , CHEN FENG
- Applicant Address: CN Shenzhen City TW Miao-Li County
- Assignee: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD.,CHIMEI INNOLUX CORPORATION
- Current Assignee: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD.,CHIMEI INNOLUX CORPORATION
- Current Assignee Address: CN Shenzhen City TW Miao-Li County
- Priority: CN200910304495.6 20090717
- Main IPC: B32B38/10
- IPC: B32B38/10
Abstract:
A method for fabricating a conductive plate includes providing a base substrate and a conductive material that includes a plurality of nanounits. The conductive material is placed on the base substrate, where a portion of the conductive material placed on the base substrate is removed.
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