发明申请
- 专利标题: Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper
- 专利标题(中): 水溶液,酸浴和电解沉积铜的方法
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申请号: US12921817申请日: 2009-04-27
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公开(公告)号: US20110011746A1公开(公告)日: 2011-01-20
- 发明人: Heiko Brunner , Bernd Roelfs , Dirk Rohde , Thomas Pliet
- 申请人: Heiko Brunner , Bernd Roelfs , Dirk Rohde , Thomas Pliet
- 申请人地址: DE Berlin
- 专利权人: ATOTECH DEUTSCHLAND GMBH
- 当前专利权人: ATOTECH DEUTSCHLAND GMBH
- 当前专利权人地址: DE Berlin
- 优先权: EPEP08008111.0 20080428
- 国际申请: PCT/EP09/03353 WO 20090427
- 主分类号: C25D5/02
- IPC分类号: C25D5/02 ; C25D3/38 ; C25D7/12
摘要:
To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids.