发明申请
- 专利标题： Flat Leadless Packages and Stacked Leadless Package Assemblies
- 专利标题（中）： 扁平无铅封装和堆叠无铅封装组件
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申请号： US12892739申请日： 2010-09-28
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公开(公告)号： US20110012246A1公开(公告)日： 2011-01-20
- 发明人: Lawrence Douglas Andrews, JR. , Jeffrey S. Leal , Simon J.S. McElrea
- 申请人： Lawrence Douglas Andrews, JR. , Jeffrey S. Leal , Simon J.S. McElrea
- 申请人地址： US CA Scotts Valley
- 专利权人： Vertical Circuits, Inc.
- 当前专利权人： Vertical Circuits, Inc.
- 当前专利权人地址： US CA Scotts Valley
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
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