• 专利标题: Low Profile Inductors For High Density Circuit Boards
  • 申请号: US12507751
    申请日: 2009-07-22
  • 公开(公告)号: US20110018669A1
    公开(公告)日: 2011-01-27
  • 发明人: Alexandr Ikriannikov
  • 申请人: Alexandr Ikriannikov
  • 主分类号: H01F27/29
  • IPC分类号: H01F27/29
Low Profile Inductors For High Density Circuit Boards
摘要:
An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.
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