Invention Application
- Patent Title: CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 芯片电阻及其制造方法
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Application No.: US12839888Application Date: 2010-07-20
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Publication No.: US20110018677A1Publication Date: 2011-01-27
- Inventor: Masaki YONEDA
- Applicant: Masaki YONEDA
- Applicant Address: JP Kyoto-shi
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto-shi
- Priority: JP2009-173782 20090727
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01L21/02

Abstract:
A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.
Public/Granted literature
- US08354912B2 Chip resistor and method of manufacturing the same Public/Granted day:2013-01-15
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