Invention Application
US20110018677A1 CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME 有权
芯片电阻及其制造方法

  • Patent Title: CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME
  • Patent Title (中): 芯片电阻及其制造方法
  • Application No.: US12839888
    Application Date: 2010-07-20
  • Publication No.: US20110018677A1
    Publication Date: 2011-01-27
  • Inventor: Masaki YONEDA
  • Applicant: Masaki YONEDA
  • Applicant Address: JP Kyoto-shi
  • Assignee: ROHM CO., LTD.
  • Current Assignee: ROHM CO., LTD.
  • Current Assignee Address: JP Kyoto-shi
  • Priority: JP2009-173782 20090727
  • Main IPC: H01C1/012
  • IPC: H01C1/012 H01L21/02
CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME
Abstract:
A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.
Public/Granted literature
Information query
Patent Agency Ranking
0/0