Invention Application
- Patent Title: ELECTRONIC CIRCUIT MODULE WITH GOOD HEAT DISSIPATION
- Patent Title (中): 具有良好散热功能的电子电路模块
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Application No.: US12839908Application Date: 2010-07-20
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Publication No.: US20110019369A1Publication Date: 2011-01-27
- Inventor: Takeshi Kanno , Satoshi Oura
- Applicant: Takeshi Kanno , Satoshi Oura
- Priority: JP2009-169867 20090721
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
An electronic circuit module includes a circuit board provided with the connector section, electronic parts provided on a mounting surface of the circuit board, a metallic board provided with a bonding section, which is superimposed on a part of the mounting surface of the circuit board, and an extension section which extends from the circuit board and is formed with the fixing through holes, a connection member that connects the circuit board to the metallic board, and a shim member superimposed at the same side as the circuit board with respect to the extension section of the metallic board, and having a thickness substantially identical to a thickness of the circuit board.
Information query
