发明申请
US20110023966A1 FLUID SUPPLY APPARATUS, FLUID APPLYING APPARATUS, AND FLUID SUPPLY METHOD 审中-公开
流体供应装置,流体应用装置和流体供应方法

  • 专利标题: FLUID SUPPLY APPARATUS, FLUID APPLYING APPARATUS, AND FLUID SUPPLY METHOD
  • 专利标题(中): 流体供应装置,流体应用装置和流体供应方法
  • 申请号: US12841710
    申请日: 2010-07-22
  • 公开(公告)号: US20110023966A1
    公开(公告)日: 2011-02-03
  • 发明人: Akihiko WatanabeTsutomu Noda
  • 申请人: Akihiko WatanabeTsutomu Noda
  • 申请人地址: JP Tokyo
  • 专利权人: SONY CORPORATION
  • 当前专利权人: SONY CORPORATION
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2009-176216 20090729
  • 主分类号: E03B5/00
  • IPC分类号: E03B5/00
FLUID SUPPLY APPARATUS, FLUID APPLYING APPARATUS, AND FLUID SUPPLY METHOD
摘要:
A fluid supply apparatus includes a piston, a piston support portion to support the piston, a container support portion capable of supporting a container in which a fluid is contained, and a drive mechanism. The drive mechanism drives at least one of the container support portion and the piston support portion in a direction in which the piston is inserted into the container at a time when supply of the fluid is performed and drives at least one of the container support portion and the piston support portion in a direction in which the piston is relatively removed from the container at a time when the supply of the fluid is stopped.
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