Invention Application
US20110031504A1 Apparatus and method for increasing thermal conductivity of a substrate 审中-公开
用于增加基底的导热性的装置和方法

  • Patent Title: Apparatus and method for increasing thermal conductivity of a substrate
  • Patent Title (中): 用于增加基底的导热性的装置和方法
  • Application No.: US12924965
    Application Date: 2010-10-08
  • Publication No.: US20110031504A1
    Publication Date: 2011-02-10
  • Inventor: Nathaniel R. QuickAravinda Kar
  • Applicant: Nathaniel R. QuickAravinda Kar
  • Main IPC: H01L29/24
  • IPC: H01L29/24
Apparatus and method for increasing thermal conductivity of a substrate
Abstract:
An apparatus and method is disclosed for increasing the thermal conductivity in a substrate of a non-wide bandgap material comprising the steps of directing a thermal energy beam onto the substrate in the presence of a first doping gas for converting a region of the substrate into a wide bandgap material to enhance the thermal conductivity of the substrate for cooling the non-wide bandgap material. In one example, the invention is incorporated into a carbon rich layer formed within the wide bandgap material. In another example, the invention is incorporated into a carbon rich layer formed within the wide bandgap material having basal planes disposed to extend generally outwardly relative to an external surface of the substrate to enhance the cooling of the substrate.
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