发明申请
- 专利标题： Bond Pad Design for Reducing the Effect of Package Stress
- 专利标题（中）： Bond Pad设计，用于减少封装应力的影响
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申请号： US12813763申请日： 2010-06-11
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公开(公告)号： US20110031618A1公开(公告)日： 2011-02-10
- 发明人: Chen-Hua Yu , Shin-Puu Jeng , Hao-Yi Tsai , Hsien-Wei Chen
- 申请人： Chen-Hua Yu , Shin-Puu Jeng , Hao-Yi Tsai , Hsien-Wei Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
An integrated circuit structure includes a semiconductor substrate, and an active device formed at a front surface of the semiconductor substrate. A bond pad is over the front surface of the semiconductor substrate. The bond pad has a first dimension in a first direction parallel to the front surface of the semiconductor substrate. A bump ball is over the bond pad, wherein the bump ball has a diameter in the first direction, and wherein an enclosure of the first dimension and the diameter is greater than about −1 μm.
公开/授权文献
- US08203209B2 Bond pad design for reducing the effect of package stress 公开/授权日：2012-06-19
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