Invention Application
- Patent Title: Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element
- Patent Title (中): 接触垫的加工方法，接触垫的制造方法以及集成电路元件
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Application No.: US12907683Application Date: 2010-10-19
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Publication No.: US20110031625A1Publication Date: 2011-02-10
- Inventor: Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
- Applicant: Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/485
Abstract:
An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region.
Public/Granted literature
- US08669666B2 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element Public/Granted day:2014-03-11
Information query
IPC分类:
