A thin film deposition apparatus for use with a substrate having deposition regions separated by non-deposition regions includes a deposition source, a first nozzle assembly disposed in front of the deposition source, at least one barrier wall assembly disposed in front of the first nozzle assembly, and a second nozzle assembly disposed between the barrier wall assembly and the substrate. At least one deposition blade is disposed between the deposition source and the first nozzle assembly, the first nozzle assembly and the barrier wall assembly, the barrier wall assembly and the second nozzle assembly, or the second nozzle assembly and the substrate. Using the deposition blade, the deposition of the deposition material on the non-deposition regions of the substrate may be minimized during a deposition process.