发明申请
- 专利标题: APPARATUS AND METHOD FOR ILLUMINATING THROUGH A CIRCUIT BOARD
- 专利标题(中): 通过电路板照明的装置和方法
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申请号: US12628114申请日: 2009-11-30
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公开(公告)号: US20110033668A1公开(公告)日: 2011-02-10
- 发明人: Richard A. Boelstler , Daniel W. Hodgman , Habib I. Baydoun , Eluid David Carter , Timothy S. Williams
- 申请人: Richard A. Boelstler , Daniel W. Hodgman , Habib I. Baydoun , Eluid David Carter , Timothy S. Williams
- 主分类号: B32B3/00
- IPC分类号: B32B3/00 ; B32B37/12 ; H05K1/18 ; F21V21/00
摘要:
An assembly includes a substrate, a flexible layer, and an adhesive mating the substrate and the flexible layer. The substrate has a first surface and a second surface opposite the first surface. The flexible layer has a first surface and a second surface opposite the first surface. The flexible layer has a thickness such that light passes through the flexible layer without substantial change to a color or an intensity of the light and such that the flexible layer substantially conforms to a shape of the substrate. The adhesive mates the second surface of the substrate and the first surface of the flexible layer and has a viscosity that substantially fills in a texture of at least one of the second surface of the substrate and the first surface of the flexible layer. The adhesive also forms substantially no air gaps.
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