发明申请
- 专利标题: METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME
- 专利标题(中): 降低基板对流与使用其的流体反应装置之间的温度差异的方法
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申请号: US12904557申请日: 2010-10-14
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公开(公告)号: US20110033919A1公开(公告)日: 2011-02-10
- 发明人: Kak NAMKOONG , Su-hyeon KIM , Jin-tae KIM , Chin-sung PARK , Young-sun LEE
- 申请人: Kak NAMKOONG , Su-hyeon KIM , Jin-tae KIM , Chin-sung PARK , Young-sun LEE
- 申请人地址: KR Suwon-si,
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.,
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.,
- 当前专利权人地址: KR Suwon-si,
- 优先权: KR10-2006-0084819 20060904
- 主分类号: C12M1/40
- IPC分类号: C12M1/40
摘要:
A method of reducing a temperature difference between a high-temperature and a low-temperature substrate includes interposing a heat transfer facilitating layer which has a higher thermal conductivity than air and can hold particles between the substrates, and maintaining close contact between the high-temperature substrate, the heat transfer facilitating layer, and the low-temperature substrate, wherein formation of an air layer can be at least substantially prevented between the high-temperature substrate and the heat transfer facilitating layer, and between the low-temperature substrate and the heat transfer facilitating layer. A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented.