发明申请
- 专利标题： PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM
- 专利标题（中）： 过程状态感知和数据分析系统
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申请号： US12911682申请日： 2010-10-25
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公开(公告)号： US20110040527A1公开(公告)日： 2011-02-17
- 发明人: WAYNE G. RENKEN
- 申请人： WAYNE G. RENKEN
- 申请人地址： US CA Milpitas
- 专利权人： KLA-Tencor Corporation
- 当前专利权人： KLA-Tencor Corporation
- 当前专利权人地址： US CA Milpitas
- 主分类号： G06F15/00
- IPC分类号： G06F15/00
摘要：
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
公开/授权文献
- US09165846B2 Process condition sensing wafer and data analysis system 公开/授权日：2015-10-20
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