发明申请
- 专利标题： Electronic device and method of manufacturing the same
- 专利标题（中）： 电子设备及其制造方法
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申请号： US12805396申请日： 2010-07-29
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公开(公告)号： US20110042812A1公开(公告)日： 2011-02-24
- 发明人: Kimiharu Kayukawa , Rikiya Kamimura , Masaya Mizutani
- 申请人： Kimiharu Kayukawa , Rikiya Kamimura , Masaya Mizutani
- 申请人地址： JP Kariya-city
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya-city
- 优先权： JP2009-189783 20090819
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50
摘要：
An electronic device includes a power element on a first substrate and an electronic component on a second substrate. The first and second substrates are stacked so that the power element and the electronic component can be located between the first and second substrates. A first end of a first wire is connected to the power element. A second end of the first wire is connected to the first substrate. A middle portion of the first wire projects toward the second substrate. A first end of a second wire is connected to the power element. A second end of the wire extends above a top of the middle portion of the first conductive member and is connected to the second substrate.
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