发明申请
US20110049687A1 ENCAPSULANT INTERPOSER SYSTEM WITH INTEGRATED PASSIVE DEVICES AND MANUFACTURING METHOD THEREFOR
有权
具有集成无源器件的ENCAPSULANT INTERPOSER系统及其制造方法
- 专利标题： ENCAPSULANT INTERPOSER SYSTEM WITH INTEGRATED PASSIVE DEVICES AND MANUFACTURING METHOD THEREFOR
- 专利标题（中）： 具有集成无源器件的ENCAPSULANT INTERPOSER系统及其制造方法
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申请号： US12942084申请日： 2010-11-09
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公开(公告)号： US20110049687A1公开(公告)日： 2011-03-03
- 发明人: Heap Hoe Kuan , Rui Huang , Yaojian Lin , Seng Guan Chow
- 申请人： Heap Hoe Kuan , Rui Huang , Yaojian Lin , Seng Guan Chow
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L21/56
摘要：
A method of manufacturing a semiconductor package system includes: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.
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