发明申请
- 专利标题： THERMOACOUSTIC DEVICE WITH HEAT DISSIPATING STRUCTURE
- 专利标题（中）： 具有散热结构的热电偶装置
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申请号： US12768059申请日： 2010-04-27
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公开(公告)号： US20110051961A1公开(公告)日： 2011-03-03
- 发明人: Kai-Li Jiang , Liang Liu , Chen Feng , Li Qian , Shou-Shan Fan
- 申请人： Kai-Li Jiang , Liang Liu , Chen Feng , Li Qian , Shou-Shan Fan
- 申请人地址： CN Beijing TW Tu-Cheng
- 专利权人： Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人： Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址： CN Beijing TW Tu-Cheng
- 优先权： CN200910189916.5 20090828
- 主分类号： H04R25/00
- IPC分类号： H04R25/00 ; F28F7/00 ; F28F13/12 ; F28D15/02
摘要：
A thermoacoustic device includes at least one first electrode, at least one second electrode, a thermoacoustic element, a base and a plurality of fins. The at least one second electrode is spaced from the at least one first electrode. The thermoacoustic element is electrically connected with the at least one first electrode and the at least one second electrode. The base supports the thermoacoustic element and the at least one first electrode and the at least one second electrode. The fins are in thermal engagement with the base.
公开/授权文献
- US08406450B2 Thermoacoustic device with heat dissipating structure 公开/授权日：2013-03-26
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