发明申请
- 专利标题： METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL
- 专利标题（中）： 用于本地抛光控制的方法和装置
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申请号： US12941816申请日： 2010-11-08
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公开(公告)号： US20110053465A1公开(公告)日： 2011-03-03
- 发明人: STAN TSAI , Feng Q. Liu , Yan Wang , Rashid Mavliev , Liang-Yuh Chen , Alain Duboust
- 申请人： STAN TSAI , Feng Q. Liu , Yan Wang , Rashid Mavliev , Liang-Yuh Chen , Alain Duboust
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; B24D11/00
摘要：
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.