Invention Application
- Patent Title: Surface mount contact
- Patent Title (中): 表面贴装接触
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Application No.: US12588778Application Date: 2009-10-28
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Publication No.: US20110059633A1Publication Date: 2011-03-10
- Inventor: Lien-Hsing CHEN , Chih-Chi CHANG , Hui-Hung HSIANG
- Applicant: Lien-Hsing CHEN , Chih-Chi CHANG , Hui-Hung HSIANG
- Applicant Address: TW Taichung
- Assignee: POWER MATE TECHNOLOGY CO., LTD.
- Current Assignee: POWER MATE TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Taichung
- Priority: TW98216501 20090907
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A surface mount contact includes a conducting pin having a shank, a first end at one end of the shank and second end at the other end of the shank, a first annular flange extending around the periphery of the shank and spaced between the first end and the second end and a second annular flange extending around the periphery of the shank and spaced between the second end and the first annular flange, and a thermoplastic connection member joined to the second end of the conducting pin and spaced from the second annular flange at a predetermined distance so that there is a room for the user to judge the connection status and quality between the conducting pin and the thermoplastic connection member during surface mounting, assuring bonding stability.
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