发明申请
- 专利标题: Printed circuit board having electromagnetic bandgap structure
- 专利标题(中): 具有电磁带隙结构的印刷电路板
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申请号: US12654307申请日: 2009-12-16
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公开(公告)号: US20110061925A1公开(公告)日: 2011-03-17
- 发明人: Han Kim , Mi-Ja Han , Dae-Hyun Park
- 申请人: Han Kim , Mi-Ja Han , Dae-Hyun Park
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2009-0087645 20090916
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.
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