发明申请
US20110062452A1 METHOD FOR PRODUCING ZINC OXIDE-BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ZINC OXIDE-BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
用于生产基于氧化锌的半导体发光器件和基于氧化锌的半导体发光器件的方法

  • 专利标题: METHOD FOR PRODUCING ZINC OXIDE-BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ZINC OXIDE-BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE
  • 专利标题(中): 用于生产基于氧化锌的半导体发光器件和基于氧化锌的半导体发光器件的方法
  • 申请号: US12882430
    申请日: 2010-09-15
  • 公开(公告)号: US20110062452A1
    公开(公告)日: 2011-03-17
  • 发明人: Chizu KYOTANINaochika Horio
  • 申请人: Chizu KYOTANINaochika Horio
  • 申请人地址: JP Tokyo
  • 专利权人: STANLEY ELECTRIC CO., LTD.
  • 当前专利权人: STANLEY ELECTRIC CO., LTD.
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2009-213292 20090915
  • 主分类号: H01L33/00
  • IPC分类号: H01L33/00
METHOD FOR PRODUCING ZINC OXIDE-BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ZINC OXIDE-BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE
摘要:
The ohmic contact between a growth substrate and an electrode formed thereon is improved in a zinc oxide-based semiconductor light-emitting device, thereby improving the light-emission efficiency and reliability A step for forming an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in sequence on a first principal face of a substrate having a composition of MgxZn1-xO (0≦x≦0.68); a step for forming microcracks in a second principal face of the substrate so as to extend toward an interior of the substrate; a step for carrying out a heat treatment at a temperature of 100° C. or higher; and a step for forming an electrode by depositing a metal material composed of one among Al, a Ga alloy, and an In alloy on the second principal face of the substrate, and forming an electrode in a heat treatment at a temperature of 300° C. to 1000° C. are provided.
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