发明申请
- 专利标题: RESIN OVERCAP PROVIDED WITH IC TAG
- 专利标题(中): 使用IC TAG提供的树脂覆盖
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申请号: US12993012申请日: 2009-06-22
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公开(公告)号: US20110063786A1公开(公告)日: 2011-03-17
- 发明人: Takayuki Kikuchi , Takahiro Kurosawa , Ken Sotobayashi , Masayuki Mori , Kazuo Tanabe
- 申请人: Takayuki Kikuchi , Takahiro Kurosawa , Ken Sotobayashi , Masayuki Mori , Kazuo Tanabe
- 申请人地址: JP Tokyo
- 专利权人: TOYO SEIKAN KAISHA, LTD.
- 当前专利权人: TOYO SEIKAN KAISHA, LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-161978 20080620
- 国际申请: PCT/JP2009/061292 WO 20090622
- 主分类号: H05K5/02
- IPC分类号: H05K5/02
摘要:
[Problem] To provide a resin overcap provided with an IC tag that can be used as an overcap being fitted onto a metal cap and having an IC tag that is so provided that the transmission and reception of signals will not be disturbed by the metal cap.[Means for Solution] A resin overcap used being fitted onto a metal cap, comprising a top panel and a cylindrical side wall hanging down from the circumferential edge of the top panel and in which the metal cap is fitted, wherein a step or a protrusion is formed on an upper portion on the inner surface of the cylindrical side wall to prevent the upward motion of the metal cap fitted in the cylindrical side wall, and an IC tag provided with an IC chip is mounted on the top panel in a manner of maintaining a predetermined distance D to a top plate of the metal cap fitted into the cylindrical side wall.
公开/授权文献
- US08411422B2 Resin overcap provided with IC tag 公开/授权日:2013-04-02
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