Invention Application
- Patent Title: Electromagnetic interference noise reduction board using electromagnetic bandgap structure
- Patent Title (中): 电磁干扰降噪板采用电磁带隙结构
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Application No.: US12654368Application Date: 2009-12-17
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Publication No.: US20110067915A1Publication Date: 2011-03-24
- Inventor: Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
- Applicant: Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0089799 20090922
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.
Public/Granted literature
- US08212150B2 Electromagnetic interference noise reduction board using electromagnetic bandgap structure Public/Granted day:2012-07-03
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