Invention Application
- Patent Title: Printed circuit board having electromagnetic bandgap structure
- Patent Title (中): 具有电磁带隙结构的印刷电路板
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Application No.: US12654370Application Date: 2009-12-17
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Publication No.: US20110067916A1Publication Date: 2011-03-24
- Inventor: Han Kim , Mi-Ja Han , Kang-Wook Bong , Hyo-Jic Jung
- Applicant: Han Kim , Mi-Ja Han , Kang-Wook Bong , Hyo-Jic Jung
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0089611 20090922
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a planar surface that is different from that of the second conductive plate, a connection pattern arranged on a planar surface that is different from that of the second conductive plate, a first stitching via unit configured to connect the first conductive plate to one end of the connection pattern through the planar surface where the second conductive plate is arranged, and a second stitching via unit configured to connect the third conductive plate to the other end of the connection pattern through the planar surface where the second conductive plate is arranged.
Public/Granted literature
- US08314341B2 Printed circuit board having electromagnetic bandgap structure Public/Granted day:2012-11-20
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