发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATED VIA AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有封装的集成电路封装系统及其制造方法
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申请号： US12563514申请日： 2009-09-21
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公开(公告)号： US20110068453A1公开(公告)日： 2011-03-24
- 发明人: NamJu Cho , HeeJo Chi , HanGil Shin
- 申请人： NamJu Cho , HeeJo Chi , HanGil Shin
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/56 ; H01L21/60
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; attaching a buffer interconnect to and over the substrate; forming an encapsulation over the substrate covering the buffer interconnect and the integrated circuit; and forming a via in the encapsulation and to the buffer interconnect.