发明申请
- 专利标题: Method For Making Semiconductor Device
- 专利标题(中): 制造半导体器件的方法
-
申请号: US12565459申请日: 2009-09-23
-
公开(公告)号: US20110070726A1公开(公告)日: 2011-03-24
- 发明人: Wolfgang DICKENSCHEID , John POWER , Danny Pak-Chum SHUM , Robert STRENZ
- 申请人: Wolfgang DICKENSCHEID , John POWER , Danny Pak-Chum SHUM , Robert STRENZ
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
One or more embodiments may relate to a method for making a semiconductor device, including: a method for making a semiconductor device, comprising: providing a substrate; forming a charge storage layer over the substrate; forming a control gate layer over the charge storage layer; forming a mask over the control gate layer; using the mask, etching the control gate layer and the charge storage layer; forming a select gate layer over the etched control gate layer and the etched charge storage layer; forming an additional layer over the select gate layer; etching the additional layer to form sidewall spacers over the select gate layer; and etching the select gate layer.
公开/授权文献
- US08470670B2 Method for making semiconductor device 公开/授权日:2013-06-25
信息查询
IPC分类: