- 专利标题： PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE
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申请号： US12960875申请日： 2010-12-06
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公开(公告)号： US20110076793A1公开(公告)日： 2011-03-31
- 发明人: Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
- 申请人： Naoto Nakajima , Shuichi Tsunoda , Akira Inaba
- 申请人地址： US DE Wilmington
- 专利权人： E.I. DUPONT DE NEMOURS AND COMPANY
- 当前专利权人： E.I. DUPONT DE NEMOURS AND COMPANY
- 当前专利权人地址： US DE Wilmington
- 主分类号： H01L33/48
- IPC分类号： H01L33/48
摘要：
The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.