发明申请
- 专利标题: EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES
- 专利标题(中): 电子设备中的可组装组件组件
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申请号: US12967234申请日: 2010-12-14
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公开(公告)号: US20110080699A1公开(公告)日: 2011-04-07
- 发明人: Erik L. Wang , Sean Murphy , Tang Yew Tan , Jeffrey Eugene Neaves , Lawrence E. Davis , Sung Kim
- 申请人: Erik L. Wang , Sean Murphy , Tang Yew Tan , Jeffrey Eugene Neaves , Lawrence E. Davis , Sung Kim
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 主分类号: H05K7/14
- IPC分类号: H05K7/14
摘要:
Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.
公开/授权文献
- US08145261B2 Ejectable component assemblies in electronic devices 公开/授权日:2012-03-27
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