发明申请
- 专利标题： LOW-LEAD COPPER ALLOY
- 专利标题（中）： 低铅铜合金
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申请号： US12575183申请日： 2009-10-07
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公开(公告)号： US20110081272A1公开(公告)日： 2011-04-07
- 发明人: Wen Lin Lo , Xiao Ming Peng
- 申请人： Wen Lin Lo , Xiao Ming Peng
- 申请人地址： VG Tortola
- 专利权人： MODERN ISLANDS CO., LTD.
- 当前专利权人： MODERN ISLANDS CO., LTD.
- 当前专利权人地址： VG Tortola
- 主分类号： C22C9/04
- IPC分类号： C22C9/04
摘要：
The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt % of lead (Pb), 0.3 to 0.8 wt % of aluminum (Al), 0.01 to 0.4 wt % of bismuth (Bi), 0.1 to 2 wt % of nickel (Ni), and more than 96.5 wt % of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt %. The low-lead copper alloy of the present invention has excellent material properties as well as good toughness and processability, thereby increasing the alloy strength and corrosion resistance thereof.
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