Invention Application
- Patent Title: MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Patent Title (中): 模块式低应力包技术
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Application No.: US12903761Application Date: 2010-10-13
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Publication No.: US20110086469A1Publication Date: 2011-04-14
- Inventor: Craig J. Rotay , John Ni , David Lam , David Lee DeWire , John W. Roman , Richard J. Ross
- Applicant: Craig J. Rotay , John Ni , David Lam , David Lee DeWire , John W. Roman , Richard J. Ross
- Applicant Address: US TX Carollton US CA Oakland
- Assignee: STMICROELECTRONICS, INC.,RJR POLYMERS, INC.
- Current Assignee: STMICROELECTRONICS, INC.,RJR POLYMERS, INC.
- Current Assignee Address: US TX Carollton US CA Oakland
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.
Public/Granted literature
- US08153474B2 Modular low stress package technology Public/Granted day:2012-04-10
Information query
IPC分类:
