发明申请
- 专利标题: SOLDER BONDING METHOD AND APPARATUS
- 专利标题(中): 焊接方法和装置
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申请号: US12581728申请日: 2009-10-19
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公开(公告)号: US20110089145A1公开(公告)日: 2011-04-21
- 发明人: Eric Benson , Danny Cam Lu , Jeffrey S. Sullivan
- 申请人: Eric Benson , Danny Cam Lu , Jeffrey S. Sullivan
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: B23K1/00
- IPC分类号: B23K1/00
摘要:
The present invention generally relates to an automated solar cell electrical connection module that is positioned within an automated solar cell fabrication line and is configured to ensure a robust and reliable bond is formed during the electrical connection process. The electrical connection module generally provides a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device. The electrical connection module further provides a thermode assembly including heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The controller is further configured to compare the actual energy versus temperature profile to an expected profile throughout the connection process and verify whether a quality bond is achieved.
公开/授权文献
- US08227723B2 Solder bonding method and apparatus 公开/授权日:2012-07-24