发明申请
US20110089145A1 SOLDER BONDING METHOD AND APPARATUS 失效
焊接方法和装置

SOLDER BONDING METHOD AND APPARATUS
摘要:
The present invention generally relates to an automated solar cell electrical connection module that is positioned within an automated solar cell fabrication line and is configured to ensure a robust and reliable bond is formed during the electrical connection process. The electrical connection module generally provides a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device. The electrical connection module further provides a thermode assembly including heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The controller is further configured to compare the actual energy versus temperature profile to an expected profile throughout the connection process and verify whether a quality bond is achieved.
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