发明申请
US20110092045A1 BURIED DECOUPLING CAPACITORS, DEVICES AND SYSTEMS INCLUDING SAME, AND METHODS OF FABRICATION
有权
打包的解除电容器，包括其的装置和系统以及制造方法
- 专利标题： BURIED DECOUPLING CAPACITORS, DEVICES AND SYSTEMS INCLUDING SAME, AND METHODS OF FABRICATION
- 专利标题（中）： 打包的解除电容器，包括其的装置和系统以及制造方法
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申请号： US12975761申请日： 2010-12-22
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公开(公告)号： US20110092045A1公开(公告)日： 2011-04-21
- 发明人: Badih El-Kareh
- 申请人： Badih El-Kareh
- 主分类号： H01L21/20
- IPC分类号： H01L21/20
摘要：
A buried decoupling capacitor apparatus and method are provided. According to various embodiments, a buried decoupling capacitor apparatus includes a semiconductor-on-insulator substrate having a buried insulator region and top semiconductor region on the buried insulator region. The apparatus embodiment also includes a first capacitor plate having a doped region in the top semiconductor region in the semiconductor-on-insulator substrate. The apparatus embodiment further includes a dielectric material on the first capacitor plate, and a second capacitor plate on the dielectric material. According to various embodiments, the first capacitor plate, the dielectric material and the second capacitor plate form a decoupling capacitor for use in an integrated circuit.
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